|Statement||F.W. Harris, M.W. Beltz, and P.M. Hergenrother.|
|Series||NASA-TM -- 89253., NASA technical memorandum -- 89253.|
|Contributions||Beltz, N. W., Hergenrother, P. M., United States. National Aeronautics and Space Administration.|
|The Physical Object|
A new readily processable polyimide. By P. M. Hergenrother, M. W. Beltz and F. W. Harris. Abstract. As part of an effort to develop tough solvent resistance thermoplastics for potential use as structural resins on aerospace vehicles, a new processable polyimide was evaluated. The synthesis involved the reaction of a new diamine, 1,3-bis 2-(3. Synthesis and Characterization of a Melt Processable Polyimide. Pages Burks, H. D. (et al.) Preview Buy Chap95 € New Processable Polyimide Based Adhesives. Pages *immediately available upon purchase as print book shipments may be delayed due to the COVID crisis. ebook access is temporary and does not include. A new readily processable polyimide. By F. W. Harris, P. M. Hergenrother and M. W. Beltz. Abstract. As part of an effort to develop tough solvent resistance thermoplastics for potential use as structural resins on aerospace vehicles, a new processable polyimide was evaluated. The synthesis involved the reaction of a new diamine, 1,3-bis 2-(3. The development of a broad line of °–°C service adhesives which are easily processed is described. The first generation film adhesives, EA and EA typically perform best up to about.
A new hydroxyl-containing fluorene-based polyimide FOH-6FPI hybrid with different TiO2 contents was prepared and used for memory device applications. The resulting films exhibited tunable memory properties from DRAM, SRAM, to WROM at different TiO2 concentrations from 0 wt% to 50 wt% with a high ON/OFF curre. Abstract. This review article deals with aromatic polyimides that are processable from the melt or soluble in organic solvents. Conventional aromatic polyimides represent the most important family of heat resistant polymers, but they cannot be processed in the melt, and their application in the state of soluble intermediates always involves a hazardous step of cyclo-dehydration and elimination. Investigation of readily processable thermoplastic‐toughened thermosets. I. BMIs toughened via a reactive solvent approach. Modification of bisphenol-A based bismaleimide resin (BPA-BMI) with an allyl-terminated hyperbranched polyimide (AT-PAEKI), Polymer, /r, Create a new account. Email or Customer ID. Towards solution-processable, thermally robust, transparent polyimide-chain-end tethered organosilicate nanohybrids Author links open overlay panel Ki-Ho Nam a 1 Jeong-un Jin a b 1 Dong Hoon Lee b 1 Haksoo Han c Munju Goh a Jaesang Yu a Bon-Cheol Ku a Nam-Ho You a.
There is a growing demand for the processable and solvent resistant polyimide resins that can withstand high temperatures, perhaps in excess of °C for extended periods of time. A promising approach to overcome these problems is the use of a crosslinkable site that reacts, on thermal cure during or after the processing, to form insoluble. These market requirements prompted the development of Extem resin, a new amorphous, melt-processable thermoplastic polyimide (TPI). Introduced by GE Plastics this past November, Extem resin is an offshoot of GE's year experience in making Ultem polyetherimide resin. This paper reviews the development of new high-temperature polymeric materials applicable to plastic substrates in image display devices with a focus on our previous results. Novel solution-processable colorless polyimides (PIs) with ultra-low linear coefficients of thermal expansion (CTE) are proposed in this paper. First, the principles of the coloration of PI films are briefly discussed. We design a novel solution-processable polyimide ZnPor-t-DSDA with porphyrin moiety (electron donor) and sulfone-containing phthalimide (electron acceptor) for polymer memory applications. The resulting memory device can be switched from low-conductivity (OFF) to high-conductivity (ON) by both positive and negative sweeps, exhibiting symmetry biswitching characteristic with a short retention.